Vacuum Deposition

What is Vacuum Deposition?

Vacuum deposition is a technique used to deposit thin films of material onto a substrate within a vacuum environment. This method ensures a clean, controlled atmosphere, free from contaminants like oxygen, water vapor, and airborne particles, which can interfere with the deposition process and affect the quality of the film.

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Types of Vacuum Deposition

• Physical Vapor Deposition (PVD):
  • Thermal Evaporation
  • Electron Beam Evaporation
  • Sputtering
• Chemical Vapor Deposition (CVD):
  • Low-Pressure CVD (LPCVD)
  • Plasma-Enhanced CVD (PECVD)

Common Substrates

• Silicon (Si): Used in microelectronics, MEMS, and optical coatings.
• Glass: Common for optical coatings, solar cells, and displays.
• Sapphire (Al₂O₃): High thermal and mechanical stability.
• Metal Substrates: Used in applications requiring durability or specific conductive properties.
• Polymers: Flexible substrates for roll-to-roll vacuum deposition.
• Ceramics: High temperature and wear-resistant applications.

Key Specifications for Substrates

• Flatness and Uniformity
• Surface Roughness (Ra)
• Cleanliness
• Thermal and Mechanical Properties
• Size and Thickness
• Electrical Properties

Substrate Selection Based on Deposition Techniques

Different deposition techniques, such as thermal evaporation, sputtering, and CVD, require substrates with specific properties like heat resistance, chemical stability, and compatibility with the deposition process.